1) Boards must be clean to begin with, especially if they're not previously "tinned" with solder. Clean the copper tracks using e.g. an abrasive rubber block.
2) Clean the iron "bit" (tip) using a damp sponge. Iron featured is an Ungar Concept 2100 Soldering Station.
3) A useful product is Multicore's Tip Tinner Cleaner (TTC) - a 15 gramme tin of special paste which cleans and "tins" the iron, in one go.
4) Insert components and splay the leads so that the part is held in place.
5) It's usually best to snip the wires to length prior to soldering. This helps prevent transmitting mechanical shocks to the copper foil.
6) Apply a clean iron tip to the copper and the lead, in order to heat both items at the same time.
7) Continue heating and apply a few millimetres of solder. Remove the iron and allow the solder joint to cool naturally.
8) It only takes a second or two, to make the perfect joint, which should be nice and shiny. Check the Guide for troubleshooting help.
9) An example of a "dry" joint - the solder failed to flow, and instead beaded to form globules around the wire.